The mobile chip manufacturer MediaTek has announced the Helio M70 modem, which will be operational in 2019. The company has partnered with Nokia, NTT Docomo, China Mobile and Huawei. The chip will be one of the first 5 Gbps connections to support 5G networks launched globally. Qualcomm has already announced the Snapdragon X50 modem targeting the Snapdragon platform

Source: SOGI

Carrier has been testing 5G networks with the near-final specification for several months was published by 3GPP in December last year . MediaTek intends to release an integrated SoC with the 5G modem, but may not be able to publish it with the Helio M70. The modem will be manufactured under TSMC's 7nm manufacturing process and will receive the first chips in early 2019 for use in commercial equipment. This is in an effort to gain a foothold in the 5G market before it grows and leaves the business behind. The company also aims to increase deliveries in 2020-2022 in order to gain a foothold in the market.

The developments of MediaTek are interesting as we already know that has decided to focus on the middle class and instead of low-end markets. As a result, these chips may be the first mid-range and low-end chips to support 5G as the technology is likely to be flagships many months after the end of the year in the lower-priced segment of the competition release. This is not the first progress the company has made in the mid-price segment over its competitors. The Helio P22 was the first mid-range SoC to be produced in a 12 nm manufacturing process. The P22 comes with Artificial Intelligence capabilities which surpass other options available in its price range. MediaTek's renewed focus on lower-end hardware is certainly causing a stir, and we may also see other chip makers strengthening their efforts as they begin to become threatening.


Source: DigiTimes

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